pb free plating product HFA30PA60C pb 30amperes,600volts heatsink common cathode ultra fast recovery rectifiers mbrf20100ct thru mbrf20200ct HFA30PA60C ? 1995 thinki semiconductor co., ltd. http://www.thinkisemi.com.tw/ page 1/2 rev.08t ultrafast recovery time soft recovery characteristics low recovery loss low forward voltage high surge current capability low leakage current application general description freewheeling, snubber, clamp inversion welder pfc plating power supply ultrasonic cleaner and welder converter & chopper ups product feature HFA30PA60C using the lastest fred fab process(planar passivation chip) with ultrafast and soft recovery characteristic. a b s o l u t e m a x i m u m r a t i n g s p a r a m e t e r s y m b o l t e s t c o n d i t i o n s v a l u e s u n i t s r e p e t i t i v e p e a k r e v e r s e v o l t a g e v r r m 6 0 0 v c o n t i n u o u s f o r w a r d c u r r e n t i f ( a v ) t c = 1 1 0 c 3 0 a s i n g l e p u l s e f o r w a r d c u r r e n t i f s m t c = 2 5 c 24 0 m a x i m u m r e p e t i t i v e f o r w a r d c u r r e n t i f r m s q u a r e w a v e , 2 0 k h z 6 0 o p e r a t i n g j u n c t i o n t j 1 7 5 c s t o r a g e t e m p e r a t u r e s t s t g - 5 5 t o + 1 7 5 c e l e c t r i c a l c h a r a c t e r i s t i c s ( t a = 2 5 c u n l e s s o t h e r w i s e s p e c i f i e d ) p a r a m e t e r s y m b o l t e s t c o n d i t i o n s m i n t y p . m a x . u n i t s b r e a k d o w n v o l t a g e b l o c k i n g v o l t a g e v b r , v r i r = 1 0 0 a 6 0 0 v f o r w a r d v o l t a g e ( p e r d i o d e ) v f i f = 1 5 a 1 . 3 5 1 . 6 0 i f = 1 5 a , t j = 1 2 5 c 1 . 2 0 1 . 4 0 r e v e r s e l e a k a g e c u r r e n t ( p e r d i o d e ) i r v r = v r r m 2 0 a t j = 1 5 0 c , v r = 6 0 0 v 2 0 0 r e v e r s e r e c o v e r y t i m e ( p e r d i o d e ) t r r i f = 0 . 5 a , i r = 1 a , i r r = 0 . 2 5 a 3 5 4 5 n s i f = 1 a , v r = 3 0 v , d i / d t = 2 0 0 a / u s 2 7 3 5 t h e r m a l c h a r a c t e r i s t i c s p a r a m t e r s y m b o l t y p u n i t s j u n c t i o n - t o - c a s e r j c 0 . 8 / w internal configuration cathode(bottom side metal heatsink) cathode anode anode base backside ? ? ? ? ? ? ? ? ? ? to-247ad/to-247-3l(to-3p)
electrical performance (typical) 0 . 1 1 . 0 1 0 . 0 1 0 0 . 0 0 0 . 2 0 . 4 0 . 6 0 . 8 1 1 . 2 1 . 4 f o r w a r d c u r r e n t i f ( a ) f o r w a r d v o l t a g e v f ( v ) f o r w a r d c h a r a c t e r i s t i c ( t y p . ) t a = 2 5 t a = 1 2 5 0 . 0 0 . 0 0 . 1 1 . 0 1 0 . 0 1 1 0 0 r e v e r s e c u r r e n t i r ( u a ) r e v e r s e v o l t a g e v r ( v ) r e v e r s e c h a r a c t e r i s t i c ( t y p . ) t a = 2 5 t a = 1 2 5 ? 1995 thinki semiconductor co., ltd. http://www.thinkisemi.com.tw/ page 2/2 rev.08t package info rmation to-247 package dimensions(millimeters) symbol min. max. a 4.80 5.20 a1 3.30 3.70 a2 2.10 2.50 b 1.00 1.40 b1 2.90 3.30 b2 1.90 2.30 c 0.40 0.80 e 5.25 5.65 e 15.6 16.0 e1 10.6 11.00 h 20.8 21.2 h1 19.4 20.4 h2 3.90 4.30 g 5.90 6.30 p 3.30 3.70 HFA30PA60C
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